Effect of Previous Acid Etching on Bonding of Self-etch Adhesives

Objectives: This study was carried out to evaluate the effect of previous phosphoric acid etching on enamel bond strength of single-step self-etch adhesives.

Methods: Four single-step self-etch adhesives: G-Bond Plus (GC), iBond Self etch (Heraeus Kulzer), Optibond all in one (sds Kerr) and Xeno V (Dentsply) were used. Flattened enamel surfaces were accomplished on human teeth by wet ground to a #600 surface. After with or without phosphoric acid etching, adhesive was applied with or without agitation for manufactures' recommended contact time, and then resin composite (TPH³: Dentsply) was bonded to treated enamel using an Ultradent bonding fixture and light cured. Ten samples per test group were stored in 37°C distilled water for 24 h, then shear tested at a crosshead speed of 1.0 mm/min. ANOVA and Tukey HSD tests were done at a significant level of 0.05. Scanning electron microscopic (SEM) observations of the adhesive treated enamel surfaces were also conducted.

Results: Shear bond strength (MPa)

Conclusion: The data suggests that previous acid etching significantly affect the bond strengths of the single-application self-etch adhesive systems.