1003   Self-etch Dentin Bonding Agent as Primer for Zirconia Ceramics

Friday, March 23, 2012: 3:30 p.m. - 4:45 p.m.
Presentation Type: Poster Session
H. LIU, and B. KOLTISKO, Technical Research, DENTSPLY, Milford, DE

Objectives: This study was conducted to identify the feasibility of using a self-etch dentin bonding agent as primer for zirconia ceramics.  Methods: Xeno IV  bonding agent (X4), Self-Cure Activator (SCA) and Calibra resin cement (CL) were used. The surface of Cercon Zirconia was conditioned as follows: The surface was sandblasted with 50 mm Al2O3 particles for 10 seconds with Micro Etcher at a distance of 10 mm with a 90° angle of the nozzle to the surface. It was rinsed, ultrasonically cleaned and dried with compressed air. Stainless steel rods (3.17 mm in diameter) were sandblasted, ultrasonically cleaned and dried. When a bonding agent was used, it was applied for 1 minute and then light cured 10 seconds, if applicable. The cement was applied to surface of steel rod and placed onto tooth surface and allowed self-cure under load.  Specimens were stored in 37°C water for 24-hr.  Half of the specimens were thermocycled 5000 times between 5 °C and 55 °C. Shear bond strength (SBS) was obtained with Instron 4400 at crosshead speed of 1 mm/min. The data was analyzed with ANOVA (n=6, a=0.05, Tukey HSD test).  Results: Mean values for SBS (MPa) with standard deviations are listed below:

CL only

X4/ No Cure

X4:SCA (1:1)/Light Cure

24 hr

9.6±4.6Ab

19.7±4.4Ba

18.7±3.6Ba

Thermocycled

0Aa

13.0 ±3.6Ba

13.4±3.7Ba

 *Within the same row, groups connected by the same upper letter are not significantly different. Within the same column, groups connected by the same lower letter are not significantly different.

Conclusion: X4 one-bottle self-etch adhesive promises an effective primer for zirconia ceramics, significantly enhancing bonding of resin cement, even in self-cure mode of cement and without prior light cure of the primer .


Keywords: Adhesion, Cements, Ceramics, Dentin bonding agents and Primer
Presenting author's disclosure statement: Employment